TSMC Kicks Off Arizona Fab 3 Construction, Bolstering Global Chip Supply Resilience

TSMC has held a tool-in ceremony to mark a key construction milestone at its Arizona semiconductor fabrication facility, with the installation of the first production equipment in the cleanroom. The fab is scheduled to begin volume production of 4-nanometer chips in 2024, followed by more advanced 3nm process technology in 2026.

This facility represents TSMC’s largest overseas investment and is set to enhance supply chain resilience for U.S. technology and automotive sectors. The project also underscores deepening semiconductor cooperation between the U.S. and Asia amid global competition for advanced manufacturing capacity. Analysts note the Arizona plant will play a strategic role in diversifying geographically concentrated production and supporting long-term ecosystem security.