Broadcom Expects to Sell One Million 3D-Stacked AI Chips by 2027
Broadcom said it expects to sell at least one million 3D-stacked chips by 2027, showing the company is rapidly expanding its influence in the custom AI chip market. The technology stacks different chips together to improve data transfer speed and energy efficiency, meeting AI computing’s dual requirements for performance and power control.
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Global N Press
2/26/20261 min read
San Jose, Feb. 26, 2026 — Broadcom said it expects to sell at least one million 3D-stacked chips by 2027, showing the company is rapidly expanding its influence in the custom AI chip market. The technology stacks different chips together to improve data transfer speed and energy efficiency, meeting AI computing’s dual requirements for performance and power control.
Broadcom has long provided custom chip design services for major technology companies. As Google, OpenAI and other AI companies expand data center capacity, custom chips are becoming an important alternative to NVIDIA GPUs.
3D stacking allows chips made with different processes and functions to be integrated within a single package, increasing computing density. For AI data centers, this means higher throughput and lower energy consumption per unit of computing.
Analysts say Broadcom’s growth reflects a shift in the AI hardware market from competition around general-purpose GPUs alone toward a new phase involving GPUs, ASICs, memory and advanced packaging.
